• State
  • Locked Locked
  • Replies 1 reply
  • Subscribers 46 subscribers
  • Views 240 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

adc14155 question

Sara Caron76
Prodigy 150 points

I am using the space qualified part. I have two layout questions.

The datasheet says "the center die attach pad of the device should be connected to ground with low inductive path." Does this pad need to be soldered for best performance?

Also I am using a single ground plane. The datasheet says

"the key is to make sure that the supply current in the ground plane doe not return under a sensitive node. This is done by routing a trace from the ADC to the regulator so it does not run under a critical node." Isn't this the same of splitting the ground plane? Should it be a separate wide trace to the regulator bulk capacitor and connecting to ground there? This is my first ADC circuit.

  • 0
    TI__Genius 17095 points

    For heat dissipation, the ground pad should be thermally connected to a heat sink, such as a gound plane.  

    If is recommended that the ground pad be soldered to the ground plane.   However, we do not have data to show what the impact to the performance would be if the ground pad was not connected.   All testing and characterization of the part is done with the ground pad electrically connected to ground.