Hi all,
My board design would be so much easier if I could tie the thermal pad of the LMP90080 to ground. Is this possible or would it degrade performance?
Many thanks,
-Rob.
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Robert,
I too am looking for this information, but on the LMP90079. The datasheet says on page 5, that the pad should be floating. However, the reference design on page 60 shows the pad tied to ground. I'm not sure which to believe.
I did discover, through a PCB manufacturing error, that the thermal pad doesn't like being tied to the SPI clock. :)
The clock was driven by a 3.3 V source, but it would not go above 2.5 volts on the scope. It also had a lot of capacitance.
I'm sure TI never intended the thermal pad to have a 5 MHz square wave on it.
Jason Pittenger
Interesting - I've tied it to ground in my designs and all seems to be working well :) Certainly makes my design easier anyway instead of punching via chimneys through my internal layers.
How much heat does this device need to dissipate anyway?
Cheers,
-Rob.
Mike,
Thank you for the clarification.
In our application, we are not using any of the current sources and the part never gets warm.
Jason.