I'm trying to solve a problem that has an obvious answer but no explicit information in the datasheet. The VQFN package for this part presumably has an underside pad which is presumably connected to ground, but the datasheet doesn't acknowledge this pad at all. Although it's unfathomable that the pad be connected to anything but ground in an ADC, I'd still expect to see that mentioned somewhere in the datasheet. In fact, the entire Layout section is written as if the VQFN option doesn't exist. I have two questions:
- Can someone from TI confirm that the pad is ground, just so I have something official to point to during a design review? Or, if I missed something obvious in the datasheet/general knowledge, can someone more attentive than me let me know?
- Do the layout guidelines in Section 12 apply in principle to the VQFN package as well? Specifically calling for >=4 vias between the copper fill (which in this case is a pad) and the ground plane?
Thank you,
Azad