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ADS8481: ADS8481 Thermal Pad connection point

Ryuuichi machida
Guru 11745 points
Part Number: ADS8481

Hi,

I would like you to confirm about below.

* Could you please tell us which pin should be connected to thermal pad ?

According to datasheet, there is following description.
"The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance."

And, I also checked EVM Layout. Then, it seems that Thermal Pad via is connected to AGND and BDGND.
Therefore I guess that thermal pad should be connected to AGND and BDGND through via.

Best Regards,

  • 0
    TI__Guru 52416 points
    Hi Ryuuichi,

    Yes, the recommendation is to solder the thermal pad to the PCB primarily for mechanical stability.

    There is no electrical connection between the thermal pad and the device in the case of the ADS8481; and therefore there is no strict requirement to connect GND to the thermal pad. However, grounding the pad will ensure no noise couples into the device and it is the preferred way to connect the device as shown on the EVM.

    Thank you,

    Kind Regards,
    Luis
  • 0 in reply to Luis Chioye
    Guru 11745 points

    Hello Luis-san,

    Thank you for your reply.
    Do you have CAD file which I can confirm by using layout viewer ?
    http://www.ti.com/lit/ug/slau182a/slau182a.pdf
    I confirmed above site to check layout. But I could not check detail on above layout information.

    Best Regards,