Other Parts Discussed in Thread: ADS122U04
I am finalizing a PCB design with the ADS122U04. It would be very helpful if I could receive the Gerber files for the EVM. I in particular want to review the Ground partitions. I am debating between a single Ground Pour on a 4layers board or having 2 Ground pours AGND and DGND. I have a BLE device also on the PCB and on our first prototype when we increased the output power of the BLE device we could clearly see the 2.4GHz noise on the output of the ADS122xxx when viewing the data through a FFT.
I am putting a grounded shield over the ADC circuitry to help alleviate this on this 2nd version and I have moved the BLE module to the other side of the PCB.
A general question I would have about the shield is whether I should attempt to create a shield that would also cover the terminal block where the 4 wires from the bridge come into the unit. I am using a low profile SMT terminal block that is only 5mm high. It would seem like it would be ideal to shield the wires as much as possible upon where the cable shielding has been pulled away to bring the individual wires into the system...