our customer uses the ADS5281 in the QFN64 package.
They have the device on a 8-layer PCB with multiple ground layers and 24 vias under the thermal pad.
How can we calculate the max. allowed case temperature of the device?
We reviewed some documents (like SLMA002G), and for some calculations require the die area so that it can be set in relation to the thermal vias copper cross area.
Could you give us some tips what to calculate?
Thanks and best regards