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Original question:

Need Junction to Case (Theta JC)- TLV5638-EP (V62/03628-02XE)

TLV5638-EP: Package thermal information/clarification desired

David Schabel
Prodigy 40 points
Part Number: TLV5638-EP

In your answer to the question "Need Junction to Case (Theta JC)- TLV5638-EP (V62/03628-02XE)", you gave a list of Theta-JC and Psi-JT for Low and High K boards.

However, you gave multiple, different values for each of those cases.  Can you explain what each of them meant, and/or re-answer the question?  

Thanks

  • 0
    TI__Genius 14540 points
    Hi David,

    The post you referenced was in April of 2013. Instead of trying to understand what was communicated then, I have requested a new thermal model with all parameters be generated for this device. Once the information is available I will forward to you. Please note, typical cycle time for such information is 2 weeks without holidays so information might be delayed somewhat.

    thanks
    Christian
  • 0 in reply to Christian Yots
    TI__Genius 14540 points

    Below are the thermal model parameters for TLV5638MDREP:

    RθJA          Junction-to-ambient thermal resistance-High K:    109.0  C/W

    RθJC(top)  Junction-to-case (top) thermal resistance:               52.5  C/W

    RθJB          Junction-to-board thermal resistance:                     51.7  C/W

    ψJT            Junction-to-top characterization parameter :             9.1  C/W

    ψJB           Junction-to-board characterization parameter:         51.2  C/W

    RθJC(bot) Junction-to-case (bottom) thermal resistance:               n/a

    Thanks,

    Christian