Hi,
Which kind of flux is BGA package(DDC316CGXGT) included?
R (Rosin)
RMA (Rosin mildly activated)
RA (Rosin activated)
WS (Water-soluble)
https://en.wikipedia.org/wiki/Flux_(metallurgy)#Flux_recovery
Best Regards,
Kuramochi
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Hi,
Which kind of flux is BGA package(DDC316CGXGT) included?
R (Rosin)
RMA (Rosin mildly activated)
RA (Rosin activated)
WS (Water-soluble)
https://en.wikipedia.org/wiki/Flux_(metallurgy)#Flux_recovery
Best Regards,
Kuramochi
Hi,
The engineer covering this part is out this week but will be back next week. Can we get back to you sometime next week on this?
Best,
Alex
Hi,
I don't think there is anything special about this package but anyhow, our packaging folks referred us to this app note:
http://www.ti.com/lit/an/spraa99b/spraa99b.pdf
According to them, section 4.2 has the info that you should consider. Please let us know if that is not the case...
Regards,
Eduardo
Eduardo-san,
Thank you for your information.
I noticed that my inquiry was not accurate, I'm sorry.
The correct question is "Which kind of flux is solder ball of BGA package(DDC316CGXGT) included?"
I think that the above application is not described about this.
Could you provide more information?
Best Regards,
Kuramochi
Hello Kuramochi-san,
Not sure we completely follow your question... Are you referring to the solder paste used on the pad prior to ball attach during our packaging process? There is some amount of flux in it but we need to check what flux material and whether it’s no clean flux. Please confirm this is what you are looking for. And can you explain why you need this, just for our curiosity?
Regards,
Edu
Hello again,
Looks like we use SAC305 solder paste during ball attach. This flux component of the solder paste (F541) is water soluble. Again, not sure that was your question so please clarify if it was not...
Regards,
Edu