Hi team,
On the datasheet at page 46 and 47 like following picture, these thermal pad are different even the IC has only 1 package.
Which one is correct data?
Best regards,
Koyo
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Hi team,
On the datasheet at page 46 and 47 like following picture, these thermal pad are different even the IC has only 1 package.
Which one is correct data?
Best regards,
Koyo
Hi Koyo,
Thank you for your query. The first drawing you have shown is an indicative drawing. The second one is what is available on the package for indicating the pin 1 position. What will be useful for you is the land pattern data in the datasheet for creating the PCB library.
Hope that answers your question.
Regards,
Uttam Sahu, Applications Engineer, Precision DAC
Hi Sahu,
You mean the 2nd picture is correct picture?
If so, first one makes us get confused, please revise the picture.
Anyway, I believe land pattern layout at page 48.
Best regards,
Koyo