My customer wants to confirm how the thermal pad on the ADS5400-SP is internally connected.
Regarding the guidance to connect the pad to AGND, they have the following questions:
- Is the AGND or DGND electrically connected to bottom of the package ground inside the ADC package?
- What are the electrical requirements for the attachment?
- What is the recommended maximum resistance between the package and the board?
- How important is the package attachment to board ground to meet ADC performance requirement?