This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

AFE1256EVM: A question about AFE1256TDS

Part Number: AFE1256EVM
Other Parts Discussed in Thread: AFE1256, AFE0064, AFE2256

Hi,

we are interested in using AFE1256TDS in our application. We are thinking about how to connect our device to AFE1256TDS, and we know that there are AFE inputs with a glass interface with 264 terminals and 100-um pitch. Do you know if there is any connector that can directly connect to this glass interface? If not, do you have any suggestions how to connect our outputs of our device to AFE1256TDS? Thank you!

  • Hi Xurong,

    The AFE1256 is intended to be directly connected to the sensor via ACF/thermal bonding. Usually, connectors with such fine pitch are not available or not useful for production.

    One option is to use AFE0064, that is TQFP package. however, the device has only 64 channels.Also, there maybe some other packaging options for AFE1256/AFE2256 that could meet your requirements. we can discuss these options over email.

    Would you be ok to continue this discussion over email? After your confirmation, our team will contact you via email.

  • Dear Shriram,

    Thanks for your reply! Yes, we can continue this discussion over email.

    Xurong

  • Dear Shriram,

     

    I just found a similar question on the forum (https://e2e.ti.com/support/data-converters/f/73/t/524428?tisearch=e2e-sitesearch&keymatch=afe1256). I would appreciate if you can provide me more information about the ACF bonding step. Do you suggest directly bonding the COF device to our detector device (on silicon or GaAs substrate)? Or do you suggest bonding the COF device to another PCB board, which is connected to our detector device? Do you have any recommendations on the companies that can provide the ACF bonding service? Thank you!

     

    Best,

    Xurong

  • Hi Xurong,

    usually standard PCBs won't support fine-pitch of the COF. So, you may need to consider special PCB process. however, interfacing directly to the sensor maybe preferred for lower parasitics (routing capacitance etc.)