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ADS1216: AGND and DGND confirmation

May
Genius 9880 points
Part Number: ADS1216
Other Parts Discussed in Thread: ADS124S06

Hi Team,

 

Does AGND and DGND are linked internally?

Customer also want to know if the backside should be linked to AGND or DGND?

Regards,

Maynard

  • +1
    TI__Guru** 113765 points

    Hi Maynard,

    I am confused regarding the question of if the 'backside' should be linked to AGND or DGND. This to me would imply the use of a power pad on the ADS1216 device package. The ADS1216 does not use a center pad in the middle of the package.  So let's make sure that we are discussing the ADS1216 and not some other device such as the ADS124S06.

    The ADS1216 AGND and DGND are linked internally but not with a direct connection. However both the AGND and DGND can share the same ground connection externally. If the AGND and DGND are at different potentials, the voltage difference must be within 300mV between them as per Absolute Maximum Specifications as given in the datasheet. It is recommended to use a single ground plane shared by both AGND and DGND. If the grounds must be split, then it is advised that the grounds be connected together near the ADC.

    Best regards.

    Bob B

  • 0 in reply to Bob Benjamin
    TI__Genius 9880 points

    Hi Bob B,

    I just received response from customer that the component is used as die ,without mold compound. They used term 'backside' but may be exposed pad or die pad will be more clear.

    Regards,

    Maynard

  • 0 in reply to May
    TI__Guru** 113765 points

    Hi Maynard,

    I will have to do some investigation and it may take a few days to respond with an answer as tomorrow is a US Holiday for TI.

    Best regards,

    Bob B

  • +1 in reply to Bob Benjamin
    TI__Guru** 113765 points

    Hi Maynard,

    This information is from the designer:

    "AGND and DGND are not tied directly together on chip.  However, there is ESD protection between them and they must stay within the Abs Max Rating.

    The backside of the die is substrate which is tied to AGND through a wire bond."

    Best regards,

    Bob B