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AFE2256: coefficient of thermal expansion of AFE2256 COF

Intellectual 405 points

Replies: 1

Views: 99

Part Number: AFE2256

Dears,

We are doing hardware design, you know bonding need to heat at the time. If bonding expands, it may be welded, so we must consider the design of welding pad pitch. Please provde the coefficient of thermal expansion of AFE225, Thank you.

  • Hello Derek,

    We would like to take the conversation offline since the device AFE2256 is under NDA.

    Can you send please your questions to afe2256-support@list.ti.com along with a reference to this E2E post?

    Regards

    Praveen

    TI makes no warranties and assumes no liability for applications assistance or customer product design. You are fully responsible for all design decisions and engineering with regard to your products, including decisions relating to application of TI products. By providing technical information, TI does not intend to offer or provide engineering services or advice concerning your designs.

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