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ADS1278-HT: Wire Bonding

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Replies: 2

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Part Number: ADS1278-HT

Hello,

I have a question concerning wire bonding with respect to the power and ground pads.  These pads are much larger than the normal I/O pads, and I am assuming this is to allow for larger wire or to allow for multiple small wire bonds to help with current handling (especially the AVDD pads).  Is there any recommendation for how many wire bonds need to be made on these larger pads, given that I am using a smaller (25um diameter) Al wire?

Thanks,

Brandon

2 Replies

  • Hello Brandon,

    You are correct, multiple bond wires are typically used on the power and ground pads to reduce the impedance (both resistance and inductance).

    I will see if we can provide some additional recommendations on the number and size of bond wires to use for these power pads.

    Regards,
    Keith Nicholas
    Precision ADC Applications

  • In reply to Keith Nicholas:

    Hello Brandon,

    See below for general guidelines on bond wire number and size based on current requirements.

    Regards,
    Keith

    Per MIL-PRF-38535:

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