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ADS1278-HT: Wire Bonding

Part Number: ADS1278-HT

Hello,

I have a question concerning wire bonding with respect to the power and ground pads.  These pads are much larger than the normal I/O pads, and I am assuming this is to allow for larger wire or to allow for multiple small wire bonds to help with current handling (especially the AVDD pads).  Is there any recommendation for how many wire bonds need to be made on these larger pads, given that I am using a smaller (25um diameter) Al wire?

Thanks,

Brandon