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Part Number: AFE5808A
I've just finished the design of 32-channel ultrasound module based on 4xAFE5808A and 2xTX7316. The PCB is 6-layer design consisting of GND plane, Power plane (splitted into different supply voltages) and 4 signal layers. My question ism if it is a good idea to add copper pour electricaly connected to GND on signal layers or not.
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add copper pour can help PCB fabrication smooth due to uniform distribution of copper on PCB layer. it can be used for the top and bottom layers.
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In reply to Xiaochen (Sean)Xu:
Thanks for prompt reply. And what about inner layers? Can I add on inner layers GND copper pour or rather it is not recommended?
And one more question about layer stackup for this design. Is Signal/GND/PWR/signal/signal/signal a good choice or you recommend other configurtion?
In reply to Mariusz Hajduk67:
i would say Signal/GND/signal/signal/PWR/signal ; or still some risks since it doesn't have solid ground.
Signal/GND/signal(PWR) vertical /signal(PWR) Horizontal /GND/signal could be another choice.
from 6 layer to 8 layer board, the cost won't be much.
typically we don't pour on inner layer. Thanks!
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