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AFE5808A: Ultrasound PCB design

Prodigy 90 points

Replies: 5

Views: 36

Part Number: AFE5808A

Hello,

I've just finished the design of 32-channel ultrasound module based on 4xAFE5808A and 2xTX7316. The PCB is 6-layer design consisting of GND plane, Power plane (splitted into different supply voltages) and 4 signal layers. My question ism if it is a good idea to add copper pour electricaly connected to GND on signal layers or not.  

Best Regards,

Mariusz

  • Thanks for using TI's AFE/TX! 

    add copper pour can help PCB fabrication smooth due to uniform distribution of copper on PCB layer.  it can be used for the top and bottom layers. 

    Regards, 

  • In reply to Xiaochen (Sean)Xu:

    Hi,

    Thanks for prompt reply. And what about inner layers? Can I add on inner layers GND copper pour or rather it is not recommended?

    Regards,

    Mariusz

  • In reply to Xiaochen (Sean)Xu:

    Hi,

    And one more question about layer stackup for this design. Is Signal/GND/PWR/signal/signal/signal a good choice or you recommend other configurtion?

    Regards,

    <ariusz

  • In reply to Mariusz Hajduk67:

    i would say  Signal/GND/signal/signal/PWR/signal ; or still some risks since it doesn't have solid ground. 

    Signal/GND/signal(PWR) vertical /signal(PWR) Horizontal /GND/signal  could be another choice. 

    from 6 layer to 8 layer board, the cost won't be much. 

    Signal/GND/signal/GND/signal/PWR/GND/signal 

    Thanks!

  • In reply to Mariusz Hajduk67:

    typically we don't pour on inner layer. Thanks!

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