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AFE5808A: Ultrasound PCB design

Mariusz Hajduk67

Prodigy 90 points

Part Number: AFE5808A

Hello,

I've just finished the design of 32-channel ultrasound module based on 4xAFE5808A and 2xTX7316. The PCB is 6-layer design consisting of GND plane, Power plane (splitted into different supply voltages) and 4 signal layers. My question ism if it is a good idea to add copper pour electricaly connected to GND on signal layers or not.

Best Regards,

Mariusz

over 3 years ago

0 Xiaochen (Sean)Xu over 3 years ago

TI__Expert 6040 points

Thanks for using TI's AFE/TX!

add copper pour can help PCB fabrication smooth due to uniform distribution of copper on PCB layer. it can be used for the top and bottom layers.

Regards,

0 Mariusz Hajduk67 over 3 years ago in reply to Xiaochen (Sean)Xu

Prodigy 90 points

Hi,

Thanks for prompt reply. And what about inner layers? Can I add on inner layers GND copper pour or rather it is not recommended?

Regards,

Mariusz

0 Mariusz Hajduk67 over 3 years ago in reply to Xiaochen (Sean)Xu

Prodigy 90 points

Hi,

And one more question about layer stackup for this design. Is Signal/GND/PWR/signal/signal/signal a good choice or you recommend other configurtion?

Regards,

<ariusz

0 Xiaochen (Sean)Xu over 3 years ago in reply to Mariusz Hajduk67

TI__Expert 6040 points

i would say Signal/GND/signal/signal/PWR/signal ; or still some risks since it doesn't have solid ground.

Signal/GND/signal(PWR) vertical /signal(PWR) Horizontal /GND/signal could be another choice.

from 6 layer to 8 layer board, the cost won't be much.

Signal/GND/signal/GND/signal/PWR/GND/signal

Thanks!

0 Xiaochen (Sean)Xu over 3 years ago in reply to Mariusz Hajduk67

TI__Expert 6040 points

typically we don't pour on inner layer. Thanks!