ADS1294: High density PCB design with Digital and Analog Grounds

I'm interfacing a CC2652RB (digital) with the ADS129X (analog). Ideally, from a signals and manufacturing perspective, I would be able to place these chips on the same top layer and connect my digital and analog grounds through a single line, but I don't think that's possible given my application size constraints. Assuming I can reflow chips onto each side of the PCB, would my best approach to PCB layering be:

1. Top: Digital signal
2. Layer 2: Digital Ground Plane
3. Layer 3: Analog Ground Plane
4. Bottom: Analog signal

The only other option would be to place the chips on the top layer, and place their supporting circuitry (capacitors, resistors) on the bottom using vias. What would you recommend?