Other Parts Discussed in Thread: DAC34SH84,
We use high speed DAC chips in some of the listed products, specifically DAC34SH84, DAC3482, and in the process of testing, it is found that there is a drum package near the IQ signal of DAC.
Therefore, the DAC self performance is verified by the DAC self test number, and the Q data is connected to the spectrum meter through 2:1 Baron from DAC, and the phase noise characteristics of the intermediate frequency signal are measured, and there is a convex situation around the remote detection of 2M).
1.DAC3482 test results
The result of the test is shown in Figure 2 below:
Fig. 2 Phase noise test results of DAC3482 I signal after Barron
发测试模式下：
cli write_txdareg 0x2D 0x0005
cli write_txdareg 0x30 0x3FFF
2.DAC34SH84 test results
Figure 3 is the result of the DAC34SH84 test.
Fig. 3 results of the phase noise test of the I signal of DAC34SH84 after balun.
3.DAC1627D1G25 test results
Figure 4 below is the result of the DAC1627D1G25 test. The device is a chip made by NXP manufacturer, which is used in our previous generation of products. The phase noise of DAC is also seen by the number of internal self test, and it is found that there is no bulge between the phase noise and 1MHz-10MHz.
Fig. 5 results of the phase noise test of the I signal of DAC1627D1G25 after balun.
