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DLPC3433: Trace width + via size recommendations for escaping BGA

Skyler Szot
Prodigy 10 points
Part Number: DLPC3433

What is the recommended trace width and via size for DLPC3433 to escape the BGA? We will be using the 176 pin package and a board thickness between 62 and 93 mils. Would you advise using microvias? Thanks

  • +1
    TI__Genius 10475 points

    Hello Skyler, 

    For the escape routing from DLPC3433 we used a 2.3mil trace width and tried to keep it as short as possible. After escaping the part the trace width depends on the stack-up and the impedance requirements for the interface which is being routed. 

    In regards to the via size we are using typically a 4mil via to escape underneath the small package DLPC3433 controller. 

    The min. trace width and the min via size should be discussed with the fab house to ensure they can manufacture that board. 

    An example can be found on our TI-Design located here:

    https://www.ti.com/tool/TIDA-01571

    Thanks,

    Nadine 

  • 0 in reply to Nadine Estermann
    Prodigy 10 points

    Hi Nadine,

    What manufacturer did you use for the board that uses the small package DLPC3433?

    Thanks,

    Skyler

  • 0
    TI__Genius 10475 points

    Hello Skyler, 

    I don't have a record of all fab shops we have used for board builds. We normally go through an assembly house who does the bidding process for us and pick the fab house. 

    The assembly houses we normally work with is QCG, Libra, SVT and Krypton. 

    Thanks,

    Nadine