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DLPC3430: 0.4mm pitch BGA breakout

first_name Sceglova
Prodigy 210 points
Part Number: DLPC3430
Other Parts Discussed in Thread: DLPC3436
I would like to know the recommendation from TI about 0.4mm pitch BGA breakout (we are going to use DLPC3430CZVBR). 
What pad and via (via-in-pad) sizes do you recommend for 12-layer PCB board? Total board thickness is 1.51mm. 
We are ready to use micro/blind/burried vias. Solder mask dam should be minimum of 0.1mm.

Also we are going to implement 0.5mm pitch BGA (LFCPNX-100-9ASG256IES) on the same board. 
It would be great to have an advice on 0.5mm pitch BGA breakout as well.
  • 0
    TI__Mastermind 23070 points

    hello Sceglova,

    Welcome to DLP forum and thank you for your interest in DLP technology. I will consult our team members and get back to you before end of the week.

    regards,

    Vivek

  • +1
    TI__Genius 10485 points

    Hello, 

    For the DLPC3430, we have used on our designs a pad size of 11mils on the top layer with a via in pad size of 4 mil. 

    Generally I would recommend to discuss that with your fab house and assembly house to understand their requirements based on your specific stack-up. The via in pad would need to meet the minimum annual ring requirement of your fab house as well. 

    Generally the rule of thumb I am using is that the pad size should not be smaller than 80% of the nominal ball size. The ball size of the DLPC3430 0.25mm so you shouldn't go below 9mil for the pad size. That being said we have not used a 9mil pad size on any of our DLPC3430 designs since a 11 mil pad size always worked for us. 

    We have a TI Design available which includes the layout for a DLPC3436 which uses the same package and pin-out as the DLPC3430. Please take a look at the TI Design under following link:

    https://www.ti.com/tool/TIDA-080009

    I am not familiar with the 0.5mm pitch part you are using but the rule of thumb of 80% of the nominal ball size would apply here as well. I would also recommend to look at the datasheet for a recommended land pattern or reach out to the manufacture for further recommendations. 

    Best regards,

    Nadine