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DLP3310: Interposer and thermal clarification

Part Number: DLP3310
Other Parts Discussed in Thread: DLP4710,

Does the DMD require an Interposer, or can it be directly soldered to a PCB? I understand the desire to, in effect, socket an expensive component, but in my application I would prefer to mount the device directly to the PCB and need to know if there is some limitation on the device itself that makes this impossible or unwise (electrically, mechanically, component life wise, etc). I'd also like to know if the answer and/or issues are the same for the DLP4710 device.

Also, is there additional information available on the use of the thermal pad? Is there a single required solution, or are there options? Should the PCB have a hole for a metal heatsink to reach through to the device, or are copper pours and via grids acceptable?