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DLP3310: Thermal interface and test pads

Part Number: DLP3310

Document DLPS124C, page 16, figure 6-14 appears to show that test pad B17 is solidly within, and pads A17,A18,B8,B18, and C8 are partially within the Thermal Interface Area, where a presumably conductive heat sink will be in contact with the device via a rectangular hole in the PCB.

Question 1: Is this a misreading of the document?

Question 2: Are these test pads able to be safely shorted to the heat sink, and thus presumably also to the heat slug on the back of the DMD?

Question 3: Is it recommended that the heat sink be milled to avoid contact with these test pads, which would naturally make it have less contact area with the DMD?

  • Hello Tim,

    Welcome to the E2E forum!

    We will get back to you by next Wednesday at the latest with answers to your questions. If you have any further questions, please let us know.

    Kind regards,


  • Hello Tim,

    1. The overlap is not a misreading of the document, it is an intentional design. The TI test pads are not used for system operation and the system interconnect does not contact these pads.

    2. Yes, these test pads can be safely shorted together by the heat sink or thermal pad.

    3. I would not mill back the heat sink to avoid contact with the test pads. The maximum size of the heat sink stud should be determined by the opening size in the interposer (and tolerances). As a reference, the mounting concept on (DLPR070) has a heat sink stud size of 6.5 x 4.0 mm. 

    Thank you for your business!

    Kind regards,