DLPA3000: heatsink and thermal design

Petr Zkrat

Part Number: DLPA3000
Other Parts Discussed in Thread: DLPA3005

Hi,

I'd like to avoid using a heatsink with my DLPA3000 design. I am planning to use an external FETs and so on to minimize heat dissipation on DLPA itself. Could you please provide RθJA for this specific case and chip, as unfortunately in the datasheet only RθJA is provided for case with a heastink?

Thanks

over 5 years ago

0 Navneet Singh over 5 years ago

TI__Expert 4610 points

Hi Petr,

Welcome to E2E forum and Thanks for showing your interest in DLP Technology.

As you can see in Typical application of DLPA3005 supports external FETs and you can find the thermal information of DLPA3005 in here : www.ti.com/.../dlpa3005.pdf , It would be the same as DLPA3000.
.

Thanks,
Navneet

0 Petr Zkrat over 5 years ago in reply to Navneet Singh

Intellectual 410 points

Hi Navneet,
thanks for answer. Unfortunately the DLPA3005 datasheet again provides only RθJA for heatsink operation, not for the package itself...

Could you please clarify?
Thanks
Petr

0 Vivek Thakur over 5 years ago in reply to Petr Zkrat

TI__Mastermind 22830 points

Hi Petr,
The package thermal parameters are shown in the DLPA3000 datasheet are for a case with a heatsink attached.

Theta-JA with no heatsink is 49.7 ºC/W and therefore power dissipation will need to be quite low for a no heatsink solution, probably ~1.5W maximum depending on the ambient temperature.

Regards,
Vivek

0 Petr Zkrat over 5 years ago in reply to Vivek Thakur

Intellectual 410 points

Hi Vivek,

Thank you, this perfectly answers my question.

Regards

Petr

0 Petr Zkrat over 5 years ago in reply to Vivek Thakur

Intellectual 410 points

Hi Vivek,
maybe one more question, does the value you sent incorporate also thermal transfer to PCB via powerpad?

Thank you
Petr

0 Vivek Thakur over 5 years ago in reply to Petr Zkrat

TI__Mastermind 22830 points

Hi Petr,
The other thermal parameters are:
1. Junction-to case (top) thermal resistance 0.7 oC/W
2. Junction-to -top characterization parameter 0.3 oC/W
3. Junction-to-board characterization parameter 28.4 oC/W

regards,
Vivek

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DLPA3000: heatsink and thermal design