Other Parts Discussed in Thread: DLP9000
The DLP9000 product manual specifies several thermal measurement contact points, including TP1 located on the back of the DLP component.
Unfortunately this contact point seems to be covered by several component layers (i.e. the PCB, plate backer, flat spring, and a back heat spreader/heat sink)
Is there any way to bypass the extra layers and place a thermo-coupled probe in this point?
Can we use the back of the heat spreader as a new effective measurement point?
Do you have any other related technical recommendations on how to measure TP1?