DLPC3433: Recommended Footprint

Antonio Fadhel

Part Number: DLPC3433
Other Parts Discussed in Thread: DLPDLCR3010EVM-G2

Hi,

Can you please share the recommended footprint for the DLPC3433CZVB? I see the ZEZ land pattern and stencil design example but not for the ZVB.

Thanks,

Antonio

over 6 years ago

0 Brandon Seiser over 6 years ago

TI__Intellectual 1825 points

Hi Antonio,

Thank you for your question. The link below shows the mechanical drawing of the ZVB package for the DLPC3433.

http://www.ti.com/lit/ml/mpbga38/mpbga38.pdf

Please let me know if you have any additional questions!

Thanks,

Brandon

0 Antonio Fadhel over 6 years ago in reply to Brandon Seiser

TI__Genius 9410 points

Hi Brandon,

I see that it is the same mechanical drawing as the datasheet. Do you have a land pattern and stencil design example for this package? (similar to what the DS has for the ZEZ)

Thanks,

Antonio

0 Brandon Seiser over 6 years ago in reply to Antonio Fadhel

TI__Intellectual 1825 points

Hi Antonio,

I will check with our team to see if we have the land pattern and stencil design drawings as in the datasheet for the ZEZ.

Is there anything specific you are looking for from the land pattern and stencil drawing? I believe all of the information in the land pattern and stencil drawing can be found in the package outline.

Thanks,

Brandon

0 Antonio Fadhel over 6 years ago in reply to Brandon Seiser

TI__Genius 9410 points

Hi Brandon,

The mechanical drawing only has the dimensions for the actual device, so the customer would like the recommended footprint (land pattern) similar to what we have for the ZEZ.

Thanks,

Antonio

0 Brandon Seiser over 6 years ago in reply to Antonio Fadhel

TI__Intellectual 1825 points

Hi Antonio,

I was able to confirm with the team that the package drawing figures in the datasheet are the only we have, so we do not have separate figures of the landing pattern and stencil drawing for the ZVB package of the DLPC3433.

However, all of the information needed for the package footprint is available in the provided mechanical drawings of both package types in the datasheet.

I'm confused on what the customer is looking for. The land pattern is a different representation of the physical dimensions. The the ZVB mechanical drawing page, the figure labeled "bottom view" actually contains additional information beyond just the landing pattern, as this image has the pin arrangement and pin pitch, in addition to the device dimensions.

If possible, can please state which dimensions the customer is looking for that are not on the mechanical drawings page?

0 Antonio Fadhel over 6 years ago in reply to Brandon Seiser

TI__Genius 9410 points

Hi Brandon,

Thanks for the reply. The customer would like the recommended dimensions of the pads for the BGA balls. Adjusting the ZEZ package numbers for the smaller pitch, would it be a 0.4 solder mask opening with 0.3 metal for the ZVB?

Thanks,

Antonio

0 Brandon Seiser over 6 years ago in reply to Antonio Fadhel

TI__Intellectual 1825 points

Hi Antonio,

The ZVB package of the DLPC3433 is used in our DLPDLCR3010EVM-G2 product. In this EVM, we use 11 mils for both the copper pad and the solder mask.

The customer should be able to extract the symbol from the .brd file from this design. The Gerbers can be found here: http://www.ti.com/tool/TIDA-01571

Please let me know if you have any additional questions.

Thanks,

Brandon

0 Brandon Seiser over 6 years ago in reply to Brandon Seiser

TI__Intellectual 1825 points

Hi Antonio,

For some of our other designs, we use 11mils for the metal and 10 mils for the solder mask. You may want to have the customer ask their PCB manufacturer which sizing they prefer.

Thanks,

Brandon

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DLPC3433: Recommended Footprint