Hi,
I am routing the High speed signals of the DLPC3433, and trying to follow the layout the recommendations of the datasheet and reference design as much as possible. However, it has been difficult to find a manufacturer capable to fulfill the min track/width (2.3 mils) as in the reference layout. So, my question is whether any of the following suggestions (taken from the datasheet) are flexible to some extend:
- "The number of vias on DMD_HS signals should be minimized and should not exceed two" -> Could I use stacked vias (they count as 2 or 1?) and then have in total four vias in one signal?
- "Differential signals: Individual differential pairs can be routed on different layers,but the signals of a given pair should not change layers" -> Could I fanout using vias only on the _N signal and the P_ on other layer? This fanout would not exceed 2 mm.
I there is other flexibility on the rules or additional documentation where I can find more information, let me know
Wladimir
