Other Parts Discussed in Thread: DLPA1000, DLP2000, DLPC2607
We are designing a system around the DLP2000, DLPC2607, and DLPA1000. We had already gotten the DLPDLCR2000EVM and then discovered it is also the Reference Design for this chipset. We have obtained and examined the design files for this Beagle Bone Black cape. We have also, of course, examined the DLPC2607 datasheet. Both of these sources of information are valuable input to our own design effort.
We are concerned with the high-speed performance of the circuit, especially the criticality of the characteristic impedance of the board, which is a function of the dielectric constant of the FR-4, the thickness of the FR-4, and the dimensions of the traces.
1. The DLPC2607 datasheet includes recommendations for trace widths and separations to achieve a 50ohm characteristic impedance for the high-speed buses connecting the SDRAM frame buffer memory and the DLP2000 DMD. It does not appear that the Reference Design complies with the recommendations in the datasheet.
2. The Reference Design has the Gerber files (which we have successfully imported into Altium and converted to a layout file), but this gives no clue to the thickness of the dielectric in each layer. Perhaps the drawing notes page has the answer, but I'm not familiar enough with PCB board fab-speak to tell. Doesn't look like it does.
