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Original question:

DLP9000X: Active array dimension specification and CAD model mismatch

DLP9500: Thermal Pad / Insulation

Philipp Pavsic
Prodigy 10 points
Part Number: DLP9500

Dear Madam or Sir,
i just repaired two Infocus IN83 an Benq W20000. The DMD-Chips are mounted as
shown in document: https://www.ti.com/lit/an/dlpa067a/dlpa067a.pdf 
(#11 s.13).

There is shown a Thermal Pad (electrically insulating) between DMD-Chip and stud.

In the data sheet  of the DLP9500 i can't find any information if the chips "Thermal
Interface Area" is electrically connected to signal ground.

In the Datasheet " DLP® Series-450 DMD and System Mounting Concepts ", site 20
says:
Be aware that the DMDs Thermal Interface area is electrically connected to signal ground
(through the Ceramic Carrier), and that some thermal pad materials are electrically conductive.

So i guess also on DMD9500 i have to use insulating thermal pads and can't use compound or
graphite pads.

I hope you can help to confirm my conclusion.

Thanks & Regards,
Ph. Pavsic

  • 0
    TI__Mastermind 43165 points

    Hello Philipp,

    We have confirmed that the symbolization pad on the back is connected to ground.  The thermal area is both the pad and ceramic around it as shown in the ICD drawing at the end of the DLP9500 data sheet.  Electrically insulating thermal material helps to prevent potential contact between the grounded symbolization pad (gold square on the back of the DMD) and the thermal stud and other pads on the back of the DMD that carry signals.

    We recommend that you follow the lead of BenQ to reduce the risk of accidently connecting any signals to ground.

    One further point of clarification, the DLP9500 DMD is not a Series-450 DMD, so some of the information there may not apply to the DLP9500.

    Fizix