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TLE4275QKTT Heat Sink Design / Thermal considerations

Jeetendra Dayaldasani9
Prodigy 10 points


Hi,

My design requirements are:

Vin = 26V - 41V DC

Vout = 5V, 50mA max, 20-30ma typical

Max ambient Temp = 55C

Attached is a low-cost solution using the TLE4275 (KTT package) part. Based on the tetha-junction-to-ambient and thermal graph in the datasheet, I am spec'ing a 1.6 in2 copper land on the PCB for heat-sinking. I calculate a max of 1.75W needing to be dissipated.

I am looking for verification that this is a viable design and seeking any suggestions to minimize the heat generation. 


Thanks!

J

 

  • 0
    TI__Genius 14890 points
    J,
    I have assigned your post to an appications engineer. Please give them a few days to respond.
  • 0
    TI__Expert 5675 points
    Hi Jeetendra,

    It should be OK according to your condition. You can use the R theta JA to calculate the junction temperature roughly as below.
    Power dissipation, PD = I × (VI – VO) + VI × IQ
    Junction temperature, TJ = TA + RθJA × PD, TA is ambient temperature.

    Please notice to pour larger area for GND, without any break by other wires is better, and enough vias through top layer and bottom layer around the big Ground pin is also essential.

    Best regards,
    Jason Liu