Could you give me the information of the internal structure around pins, materials and cross-section shape of following devices.
Background :
On the current product, because of some reasons, the devices from the other vender are used. But some of them fell down without
their pins. So I plan to compare the devices and if I replace them to TI's, it reduces the possibility for the devices to fall down or not.
Regards,
Hello,
Can you explain what you mean by "some of them fell down without their pins"? Was this a delamination issue?
As for some of the information you're requesting, like the internal structures, that is classified information that I cannot share on E2E. The lead finish materials are available in the package option addendum of the data sheet. Also, if you go to the "Quality & Reliability" section of ti.com, you can access more in depth reports related to the materials used in the device.
Regards,
Matt Smith
