DS26F31MQML-SP: Thermal parameters?

Furkan Fehmi Sefiloglu

Expert 3118 points

Part Number: DS26F31MQML-SP

Hi Team,

Can you please advise with following request?

Thermal Conductivity Coefficient(W/m*K)
Thermal(Heat) Capacity(J/kg*K)

Thanks in advance

Best Regards

Furkan Sefiloglu

over 3 years ago

0 Hao L over 3 years ago

TI__Mastermind 25705 points

Furkan,

Do you ask for the thermal conductivity coefficient and thermal capacity of the mold compound?

0 Zafer Caliskan over 3 years ago in reply to Hao L

Prodigy 50 points

Dear Hao,

We would like to know CFP package thermal characteristics in terms of Thermal Conductivity Coefficient and Thermal(Heat) Capacity(We could not find any specific value for CFP package on the web) . These parameters will be used as an input for the simulation.

Regards,

Zafer Çalışkan

0 Hao L over 3 years ago in reply to Zafer Caliskan

TI__Mastermind 25705 points

Thanks for your explanation. I will find out the information.

0 Hiep Nguyen over 3 years ago in reply to Hao L

TI__Prodigy 70 points

There are many materials used inside a package: Silicon, Die attach, Wires, Lead Frame and Ceramic Header. Each material has its own properties. There isn't one set of material properties. What kind of simulations are you doing and what modeling tool/software are you using?

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DS26F31MQML-SP: Thermal parameters?