SN65HVD232Q: CUP structure

Charles Zhang1

Part Number: SN65HVD232Q

Hi Team

My customer needs to learn if SN65HVD232Q is CUPstructure (referring to active circuitry on the die underneath the bond pads) to recognize the material, could you kindly provide the information?

Regards,

over 3 years ago

0 Eric Hackett over 3 years ago

TI__Guru 72132 points

Charles,

We'll have to talk to the design team about this. I'll respond when we get more information.

Regards,

Eric Hackett

0 Charles Zhang1 over 3 years ago in reply to Eric Hackett

TI__Expert 3110 points

Hi Eric,

Is there any update? Thanks.

Regards,

0 Eric Hackett over 3 years ago in reply to Charles Zhang1

TI__Guru 72132 points

Charles,

I appreciate your follow-up and patience on this. Since people are just coming back to the office after the holidays, let me see if I can get a response on this.

Regards,

Eric Hackett

0 Eric Hackett over 3 years ago in reply to Eric Hackett

TI__Guru 72132 points

Charles,

I'm still trying to get an answer on this, thanks for your patience.

Regards,

Eric Hackett

+1 Eric Hackett over 3 years ago in reply to Eric Hackett

TI__Guru 72132 points

Charles,

The design team informed me that there is no active circuitry underneath the bond pads on this device.

Regards,

Eric Hackett

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SN65HVD232Q: CUP structure