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[FAQ] Which conformal coating is recommended for Ethernet PHY products?

  • TI does not have a recommendation for any specific conformal coat or underfill product.
  • In some temperature ranges these materials can be detrimental if the conformal coating or underfill product has a mismatched CTE vs. solder joint (Z axis).  This mismatch combined with modulus of the material at certain temperatures can actually shorten the service life. 
  • Due to this the customer should evaluate the performance of the underfill/conformal coating materials at an assembly level for the intended mission profile.