DS160PT801: BGA structure diagram data request

yutaro hayashi

Expert 1330 points

Part Number: DS160PT801

Hi Support Team.

Please tell me the following information of XIO2001IZAJ.

・Copper pad diameter(mm)

・Copper pad thickness(mm)

・Solder mask openting diameter(mm)

・Solder mask openting thickness(mm)

↓Reference diagram

Thanks,

Yutaro

over 1 year ago

0 Nicholaus_Malone over 1 year ago

TI__Mastermind 18430 points

Hi Yutaro-san,

Most of the ZAJ package information is available here: ZAJ (S-PBGA-N144) 4207337-2 (Rev. A) (ti.com)

The measurements you are asking for are not listed, so I will need to ask internally to see who might have the answer. Please allow me some time to do this.

Regards,

Nicholaus

0 yutaro hayashi over 1 year ago in reply to Nicholaus_Malone

Expert 1330 points

Hi Nicholaus

sorry.

The requested model name was DS160PT801ACBR, not XIO2001IZAJ.
It's my typing error.

I would like information on the DS160PT801ACBR.

Yutaro

0 Nicholaus_Malone over 1 year ago in reply to yutaro hayashi

TI__Mastermind 18430 points

Hi Yutaro,

Alright thanks. I have asked the internal team and am waiting for a response.

Regards,

Nicholaus

+1 Nicholaus_Malone over 1 year ago in reply to Nicholaus_Malone

TI__Mastermind 18430 points

Hi Yutaro,

I have received a response about the DS160PT801ACBR.

FC Pad construction : SMD
FC Pad Copper pad diameter(mm) = 110um
FC Pad Copper pad thickness(mm) = 15um
FC Pad Solder mask opening diameter(mm) = 80um
FC Pad Solder mask opening thickness(mm) = 15um

Note, there are 2step SR on Die mount side of substrate.

SR thickness beneath the die is 15um.

SR thickness on the rest of area is 25um.

Regards,

Nicholaus

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DS160PT801: BGA structure diagram data request