TLIN1029-Q1: TLIN1029-Q1 about max power consumption

Lawrence,

The maximum power consumption of the device is dependent upon the ambient/environmental temperature, along with the other thermal relief pathways from the device. The junction-to-ambient thermal resistance (and the junction-to-top characterization parameter) only account for this thermal pathway. You could make some worst-case thermal boundary calculations using this kind of analysis, but the best way to get a good idea would either be to simulate your board/chip, or to evaluate using a thermal analysis method that takes into account all of the thermal resistances for the chip.

Best,

Danny

Lawrence,

Also, this application note might be useful in evaluating thermal metrics for an IC.

Best,

Danny