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SN75ALS1178: Electrical Specification Difference between SO package and DIP package

Part Number: SN75ALS1178

Dear Specialists,

My customer is evaluating SN75ALS1178NSR(SO Package) and SN75ALS1178N(DIP package) .

They have questions, I would be grateful if you could advise.

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Since SN75ALS1178NSR (SO Package) was not available, communication was not possible when evaluating whether SN75ALS1178N (DIP package) could be used instead in our equipment.

We thought about the cause.

(1)The package size is larger for the DIP package, and the wiring of the bonding wire is longer, so I guessed that the timing would be delayed.
Is this correct?

(2)On the other hand, the data sheet has the same timing regulation,

We believe that the DIP package is distributed on the slower side in this specification, and the SO package is distributed on the faster side.

Is this assumption correct?

Please let me know what else you can think of.

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I appreciate your great help in advance.

Best regards,

Shinichi

  • Hi Shinichi,

    1. The datasheet still bounds all the packages - we didn't differentiate between packages on the timing parameters. There will most likely be some marginal change - but the package parasitics are not going to considerably slow down the device and will still be bounded by datasheet with the larger package. 

    2.Yes the timing specs bound all packages - it is true that the bigger package could be marginally slower, but when looking at the Datarate of this device the difference is going to be marginal and still bounded by the datasheet.

    If the application will work with worst case data-sheet considered there really shouldn't be an issue (besides a layout change due to bigger package) by switching to the larger packaged version.

    Please let me know if you have any other questions!

    Best,

    Parker Dodson

  • Hi Parker,

    Thank you for your reply.

    I'll share your comment with the customer.

    When the customer has an additional question, I consult you again.

    I appreciate your great help and cooperation.

    Best regards,

    Shinichi