Dear Specialists,
My customer is evaluating SN75ALS1178NSR(SO Package) and SN75ALS1178N(DIP package) .
They have questions, I would be grateful if you could advise.
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Since SN75ALS1178NSR (SO Package) was not available, communication was not possible when evaluating whether SN75ALS1178N (DIP package) could be used instead in our equipment.
We thought about the cause.
(1)The package size is larger for the DIP package, and the wiring of the bonding wire is longer, so I guessed that the timing would be delayed.
Is this correct?
(2)On the other hand, the data sheet has the same timing regulation,
We believe that the DIP package is distributed on the slower side in this specification, and the SO package is distributed on the faster side.
Is this assumption correct?
Please let me know what else you can think of.
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I appreciate your great help in advance.
Best regards,
Shinichi