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SN75175: Questions about SN75175 old datasheet (SLLS145C) and new datasheet (SLLS145D).

Kazuya Nakai59
Guru 20780 points
Part Number: SN75175

Hello guys,

One of my customer uses SN75175 for their current products.

Recently, they knew SN75175 datasheet was updated from version SLLS145C to SLLS145D.
At this moment, they have the following questions.
Could you please give me your reply?

Q1.
SLLS145D Absolute maximum rations, Recommended Operating Conditions, 
Electric characteristics, Switching characteristics are same as SLLS145C.

But the following graphs in SLLS145D are big different from SLLS145C.

    SLLS145C                        SLLS145D

    Figure 4 ~ 12      <->        Figure 5-1 ~ 5-9

Is either graph wrong?

Q2.
If Q1 answer is NO, could you please tell me why such big difference of graphs happened in detail?

Q3.
Are the graphs in SLLS145D the characteristics of the device produced by new process (LBC9) in RFAB?
Can the LBC9 SN75175 be used without any problem as a alternate device for SN75175 old process device?

If you know any concerning point, please let me know?

Your reply would be much appreciated.

Best regards,
Kazuya.   

  • 0
    Guru 279890 points

    RFAB uses larger wafers with an entirely new design, so the typical values have changed.

    The specifications of both versions are inside the guaranteed electrical characteristics. If your circuit does not rely on characteristics that are outside the guaranteed limits, then there will be no problem.

  • 0
    TI__Mastermind 46687 points

    Hi Kazuya,

    1. Graphs are typical characteristics and aren't guarantees for operation - they are just there to give the designer an idea of how the device may operate at typical conditions. The recent part update is due to a complete redesign - both legacy and new material are bound by the same boundary conditions set out in electrical specification tables in datasheet which means that if the older design was designed with respect to boundary conditions on legacy device there shouldn't be issues using new material - but there most likely will some differences in typical behavior - however at a system level this should largely be negligible . 

    So graph is showing new material - but boundary conditions are same for old and new material. During these redesigns the main goal is to keep legacy use cases in mind so the new version of the devices will work in legacy applications. 

    2. Its a complete redesign of part - there are different typical characteristics. That's why - but they are bound by same conditions are old device so if old system with legacy device was designed correctly with respect to our recommendations there shouldn't be an issue. 

    3. Yes the new material should be able to be used in the same applications as old material. We haven't seen any reported issues at this time due to using newer material and we believe the risk to be very low of issues occurring as we recommend that old systems move to the new material. 

    Please let me know if you have any other questions!

    Best,

    Parker Dodson