SN65HVD10-EP: Thermal model for AEDT Icepak needed

Hi Michele,

We typically don't provide those kind of models for our commercial parts. The device you're asking for is a high reliability part so I can ask that team if they provide models for that and get back to you.

EDIT: I verified with the high reliability team, it seems they do not provide these models either. 

-Bobby

Hi Bobby,

Thank you for your quick reply. Would it be possible to create such a thermal model for the mentioned part?

In my other case "DP83867E:Thermal models for AEDT Icepak needed" it seems that a thermal model will be newly created for the component.

Could maybe the same team create a thermal model for the RS485?

BR Michele

Hi Michele,

I can try reaching out to our design team to see if their IDE allows them to generate a .tzr output extension but the device that your interested in is from 2004. Devices this old, we don't have the design files for anymore. 

The only other contact that I have is in the thermal modeling team but to my knowledge they only generate thermal parameters with packaging data we provide them. I'm not sure if they generate .tzr files for customers.

I'll reach out to both contacts and see what they have to say.

-Bobby

Hi Michele,

The thermal modeling team stated we can put in a request through them. I've submitted a ticket with them.

In the past, my usual thermal parameter requests took 2 weeks to fulfill, I'm not sure how long this one will take but will follow up in 2 weeks if we don't see anything. 

-Bobby

Hi Bobby,  

Could we also place a ticket for a thermal model for the device PMIC TPS6594-Q1?

Thanks a lot.

BR Michèle

Hi Michele,

Are you able to submit a separate e2e ticket for that? I am responsible for transceiver devices and I'm not really supposed to provide support outside of my responsible devices. I'm pretty sure the group responsible can help submit the ticket for you.

You can point them back to me or this thread and so they know that this can be done using TI's internal thermal request sharepoint. I believe all they need is get the traveler data for the device which they can pull from atss/, after that they can generate the support ticket and request in one of the comment boxes for the .TZR output file. If they need additional help, I can walk them through it. 

-Bobby

Hi Bobby, 

I pointed the collegue dealing with the PMIC-component back to this thread, so I think he will contact you. 

Thank you very much for making this possible.

BR, Michèle

Hi Michele,

No problem. I'll get back to you when I hear back from the thermal team about the output file. I still expect this will be ready by the first week of April but I'll let you know if anything changes.

-Bobby

Hi Bobby,

Do you have any update on this topic?

BR Michèle

Hi Michele,

It looks like Nicolas (the other engineer that you reached out to in another thread) has emailed the thermal modeling team and CC'd me on it. He's trying to figure out the time line on when this will be completed. I'll give you an update when I hear back from that team. I imagine they will get back to us tomorrow with a response.

-Bobby

It looks like the engineer has estimated we should have the output files ready by tomorrow. 

-Bobby

Looks like our ticket has changed status from 'not started' to 'in progress' so I think we are still on track for some sort of deliverable today or tomorrow.

-Bobby

Hi Bobby,

Thank you very much, the model is working  :)

Who can I contact if I have questions about the model later on?

BR, Michèle

Hi Michele,

Our group has a dedicated resource for thermal models. I've heard some product lines have product engineers who specialize in thermal modeling but for transceiver products, we don't really get many questions/concerns about thermal. Most questions are just calculating/estimating power dissipation and how much power a transceiver can handle before it exceeds the junction temperature.

-Bobby

Hi Bobby,

I have just one question about the thermal model you send me:

The model contains several monitoring points and one of these is named "pmon_Case_temp_1". Does this monitor point measure the temperature on top of the component? 

I am asking because this monitoring point is located 1mm above the component (in the air) and not directly on top of the component case. Is that right?

BR Michèle

Hi Michele,

I can try to ask the person who generated the file but they may not know either; support on these thermal files are limited. I'll try to get back to you tomorrow on their response.

-Bobby

"I don’t see any monitor points present when I open the model, so I’m not sure why that would be.  The monitor points would not affect the usage of the model though."