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DS560DF410: IBIS model of DS560DF410

Part Number: DS560DF410
Other Parts Discussed in Thread: DS560MB410

Tool/software:

Hi,

Can you please provide me the ibis model of DS560DF410?

I am planning to run SI simulation for I2C inputs of TI DS560MB410s(using DS560DF410’ model file) that we don’t have the ibis model file.  

Can I assume that the I2C inputs of these two devices have similar characteristics?

Br

Arda

  • Hi Arda,

    The IBIS-AMI file for DS560DF410 is just the high speed RX/TX.  We don't have an ibis model for I2C.

    Do you have concerns about I2C implementation in your design?

    Thanks,

    Drew

  • Hi Drew,

    Actually, we are using DS560MB410(you don't have an IBIS model for this part) and 8xDS560MB410s are connected to same I2C bus so i just would like to run a SI simulation to see if there will be any problem.

    Br

    Arda

  • Hi Arda,

    Thanks for clarifying this.  The DS560DF410 uses a different process node than DS560MB410, so we expect that DS560DF410 I2C model would not be a great representation of DS560MB410 I2C.

    I'm checking in with my team to see what models we have available in order to enable some analysis on your end.

    Thanks,

    Drew

  • Hi Arda,

    Unfortunately we don't have an IBIS model suitable for modeling DS560MB410 I2C.

    We would recommend using the SMBus electrical characteristics (in data sheet) to model the I2C bus.  In particular, the pin capacitance and leaking current can be used.

    Please note that the I2C specification specifies a maximum bus capacitance of 400 pF for fast mode (400 kHz).  This suggests that connecting 8x DS560MB410 with <15 pF each would not be an issue if these are the only devices on the bus.

    Thanks,

    Drew