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TPD4E05U06-Q1: Questions on material and certification of this part-

Lauren Mayfield

Expert 7765 points

Part Number: TPD4E05U06-Q1

Tool/software:

Hi all, can you help with the below questions-

Can you provide the IATF 16949 certificate(s)?
Can you confirm if this part has bimetallic wire bonding to the IC die? The PPAP states the wire bond material as Au. It then states item #11 Die metallization material(s) as AlCu.
If this part does have bimetallic wire bonding to the IC die, does TI perform any purple plague mitigation?

0 Sebastian Muriel 3 months ago

TI__Genius 17340 points

Hi Lauren,

1. You can find certificates for all of TI's sites here: https://www.ti.com/support-quality/certifications-and-standards/certifications.html

2/3. I'm checking with our packaging team to see if this is considered bimetallic and get back to you on this post.

Regards,

Sebastian

0 Lauren Mayfield 3 months ago in reply to Sebastian Muriel

TI__Expert 7765 points

Hey Sebastian, any update on this?

0 Sebastian Muriel 3 months ago in reply to Lauren Mayfield

TI__Genius 17340 points

Hey Lauren,

So far I've confirmed that the wirebonding is considered bi-metallic, but I'm still waiting to hear back on the purple plague mitigation.

Best regards,

Sebastian