Tool/software:
Hello
I'm working for a project with FUSA requirement.
The safety complexity of this project is ASIL B，FMEDA analysis is necessary.
I originally try to obtain the Safety materials(contain failure rate and failure mode) from FAE&Sales team, but they told me, FUSA file is not ready yet.
So, I might to calculate the failure rate with the IEC62380.
Could you help me to obtain the information below?
Detailed MPN:TXS0104EPWR
Catalog: IEC/TR 62380:2004-08, First edition
Category: Integrated Circuits (Section 7)
Type details:?
Technology:?
Material Substrate:?
Package failure rate:?
Thermal resistance:?
Interface circuits:?
Number of transistors:?
Year of manufacturing:?
Example for other manufacture's CHIP:
Catalog: IEC/TR 62380:2004-08, First edition
Category: Integrated Circuits (Section 7)
Type details: MOS (Silicon, standard circuits) Linear circuits
Technology: Bipolar, BiCMOS (high voltage)
Material Substrate: Epoxy Glass (FR4, G-10)
Package failure rate: Determine package failure rate based on package diagonal Epoxy (Plastic package) Two rows connections package
Thermal resistance: Junction-ambient thermal resistance given by manufacturer (R_ja)
Interface circuits: Non Interfaces
Number of transistors: 1865
Year of manufacturing: 2022 year
