Tool/software:
Hello Application team:
could you please provide the SN65DSI83TPAPRQ1 following dimension for our reference ? thank you
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Tool/software:
Hello Application team:
could you please provide the SN65DSI83TPAPRQ1 following dimension for our reference ? thank you
Hi Roy,
Are these specific measurements required? The dimensions already shown in the image you shared are in the "PACKAGE OUTLINE" page, although it doesn't show the dimensions of each turn and corner like you marked in red.
If it's just for creating footprint and landing pattern, the customer could refer to the "EXAMPLE BOARD LAYOUT" and "EXAMPLE STENCIL DESIGN"
Best regards,
Ikram
Hello Ikram:
Thank you for your information ^^.
I just talk with my customer they still need the dimensions for their factory rule.
is any possible to get the data from design team?
thank you
Roy
hi Roy,
On the drawings you will find that the thermal pad area has a range:
And on the actual units the tie bar strap features outside the pad could also be covered by the mold compound. Generally, customer don't need these details for their process. For information purposes, these are the measurements:
Please note that the landing patterns, exposed metal, solder mask, etc. should still be based on what is shared in the datasheet as we mentioned earlier.
Best regards,
Ikram