SN65HVD11-HT: The device failed after 75 hours @ ~205C Ambient.

More info, the pin connections of the device were checked and found to be fine (no opens). The device is in HKQ ceramic package.

FZ,
The device was qualified to operate for 1000 hours at specified conditions.
Can you provide your schematic to evaluate if there are any issues that may be related to shorter life?

The datasheet has a section on Tj, and also list Ta ranges. The values for Tj are listed as typical, but these should be interpreted as max.
Thus, if you have a higher power dissipation, you may be exceeding the max Tj of the device.

Regards,
Wade

Hi Wade,

Thank you for your quick response. Below is the schematic capture. All the temperature measurements (Ta) did not show anything higher than 207C. Tj should be below 214C (MAX?).

Thanks,

Thanks for the schematic.
Using the 214c as a max would be appropriate.

The HKJ package is typically mounted dead bug (leads up), with the lid essentially operating as the thermal pad mounted to the board.
The datasheet indicates that the theta Jc (bottom) (actually the top mounted upside down) is 6.2 degrees per watt.

If the device is mounted to the board with a thermally conductive adhesive, then the max junction rise will be limited. It is estimated that the max power would be 176mW from commercial datasheet characterization) This would lead to a 1.1 degree rise above board temp. However, we do not know your board temp in this scenario since you are only monitoring Ta.
The Ta, would be similar to the HKU package. If we estimate this to be the same of 170 degrees/watt, then the rise above ambient would be estimated to be nearly 30c.

Do you have device thermally attached to board?
Is board temp constrained.

Regards,
Wade

Hi Wade,

Thank you again for looking into this issue.

Yes. There is a RTD on the board showing board temperature to be ~206C. And thermal imaging taken at room temp only showed -3 degree rise of this device package without any air circulation. The oven circulates the air that maintains the chamber temperature at ~205C. So, it should be fairly reasonable to say the temperature of device package is lower than 210C.

Also the duty of the device is less than 10%. The power consumption should be less than 176 mW.

Thanks,

FZ

It appears that this device should have survived this issue, unless there was some other kind of electrical overstress.
I will work with our QA, and provide you information via email to pursue getting this unit returned for analysis.

Regards,
Wade

Thank you, Wade.

I have an online request filed. Here is the Service Request# 1-4647230066 .

If you can link them, that will be great.

And my second unit is working fine so far without any issues.

Thanks,