Is there an Arrhenius plot of MTTF (hours) vs junction temperature available for this die?
Thanks,
-Jonathan
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Is there an Arrhenius plot of MTTF (hours) vs junction temperature available for this die?
Thanks,
-Jonathan
Jonathan,
I received feedback from our quality and reliability team.
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A specific plot for this technology is not available. In general TI processes are designed to exhibit a failure rate no worse than 50 FITs (Failures In Time or failure per billion device hours) in 100,000 power on hours when operating at nominal datasheet conditions excluding voltage transients. The maximum operating temperature specified in the datasheet refers to the fact that the device is warranted to fully function up to that temperature. No statement is made nor is any warranty implied as to reliability or operating lifetime. Please see the TI DPPM/FIT/MTBF Estimator. A general estimation of MTBF at various temperatures may be extrapolated using the data provided. JESD85 “Methods for Calculating Failure Rates in Units of FITs” will provide more information on these calculations.
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If this answers your question, please click "Verify it as the answer"
Regards,
Wade
I believe you are using the calculator correctly.
However, exceeding the absolute max Tj of 150c would invalidate the warranty. Higher temperatures may cause other activation energies to be more dominant.
I will get confirmation from our reliability team, but I believe this to be correct.
Regards,
Wade
Wade,
The 155°C is a hypothetical situation but can you find out from the reliability team which activation energy value to use if this is the case?
In my application, I project the component to have a Tj of 135°C but it would be good to have knowledge for other parts that may get close to the max junction temperature specified on the datasheet.
If you'd like to reference what I am working on, please see the attachment.
In the lab test for the AM26LS33AMFKB, are the (qty) 36407 samples tested at 125°C package case temperature, ambient temperature, or is the 125°C specifying the junction temperature?
The delta T rise of the component from 125°C ambient or case to the junction temperature may be close to or higher than 150°C for this package depending on the test environment.
Thank you for your continued attention.
Hello Wade,
Have you gotten a chance to review my previous post to verify with a reliability or thermal engineer?
Thank you,
They were able to complete it quickly.
Note, that Theta Jc bottom is not normally provided. However, it was modeled here along with the assumptions.
Here are the parameters for both packages:
For the FK package
Theta JA-High K (standard datasheet value): 65.5
Theta JC, top (standard datasheet value): 40.3
Theta JB (standard datasheet value): 39.4
Psi JT (standard datasheet value): 33.3
Psi JB (standard datasheet value): 38.8
Theta JC, bottom (standard datasheet value): 4.2 Modelling Assumptions: no PCB via, package body not soldered to PCB.
For the J package
Theta JA-High K (standard datasheet value): 74.6
Theta JC, top (standard datasheet value): 37.6
Theta JB (standard datasheet value): 56.1
Psi JT (standard datasheet value): 26.4
Psi JB (standard datasheet value): 58.5
Theta JC, bottom (standard datasheet value): 13.1 Modelling Assumptions: no PCB via, package body not soldered to PCB.
If this answers your question, please click "Verify it as the answer"
Regards,
Wade