Team,
- What is the EXACT recommendation for creating the footprint specifically the center plane copper and solder mask dimensions?
- What is the EXACT paste aperture recommendations for 4 mil, 5 mil and 6 mil foils for the center plane paste deposit?
- What is the exact dimension (Height) from the bottom of the perimeter lead foot to the thermal pad on the bottom of the component? I’m aware that the thermal pad on the component is recessed into the epoxy and that the results in additional height above the plane of the perimeter leads.
We are trying to minimize the post reflow voiding.
Thank you.