Other Parts Discussed in Thread: TIDA-01425
The data sheet for the DP83tc811r-q1 recommends to void metal under the CMC on the top layer.
The TI TIDA-01425 Automotive Stand-Alone Gateway Reference Design with Ethernet and CAN does this and leaves the underlying ground plane intact.
The DP83TC811EVM User's Guide (SNLU231–November 2017) voids not only the top layer metal but all of the underlying ground and power planes as well.
Which is currently recommended for automotive applications?