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THVD2450: Upgrade robustness using THVD2450

Alicia Rosenberger
Expert 7280 points
Part Number: THVD2450

Hi,

To save space and upgrade robustness against machine wiring faults, I am considering upgrading from

SN65HVD485EDR (in SOIC8)

to

THVD2450 (in VSSOP8)

in this new version of the circuit board.

  • Is THVD2450 the best choice for industrial environments? (were 30V can accidentally be shorted to RS-485 data line)
  • Is there any advantage to THVD2450 in the larger SOIC8 vs. VSSOP8?
  • Do manufacturers have trouble with the SON package floating off the pads?
  • Which package has the highest quantity per year demand?

Thank you for your help.

Best,

~Alicia

  • 0
    TI__Guru 62910 points

    Hi Alicia,

    Yes, THVD2450 is the device I would recommend for industrial applications requiring higher-voltage tolerance.  It is a very "robust" device in terms of DC voltage tolerance (+/- 70 V on A/B), transient tolerance (support for IEC 61000-4-2 up to 12 kV), and noise tolerance (indicated by the 4-kV IEC 61000-4-4 specification).

    In general there are no performance advantages to the larger device.  It does naturally have lower thermal resistance to ambient air/PCB, which may be a consideration for very high temperature applications.  Beyond that, sometimes the SOIC package is preferred due to reuse of existing PCBs or due to ease of multi-sourcing.  (SOIC is the most widely-available package type for RS-485 transceivers and tends to have the highest demand accordingly.)

    I haven't heard of any solderability issues with the SON package.  As long as the stencil is designed to deposit the right amount of solder paste in the pad area the device should not float off of the pads.  There is a recommendation given in the mechanical drawing section of the datasheet that could be used as a starting point, although often customers will adjust these dimensions based on their own manufacturing flow (and factors like the stencil thickness, number/width of vias in the pad area, etc.).

    Regards,
    Max