DS26F31MQML-SP: Junction-to-case thermal resistance?

Gregory Duperon

Part Number: DS26F31MQML-SP
Other Parts Discussed in Thread: DS26F32MQML-SP,

Can you confirm that the junction to case value for DS26F31MQML-SP (NAD pkg) and DS26F32MQML-SP (NAD pkg) is to the top or bottom?

over 4 years ago

0 Miguel Robertson over 4 years ago

TI__Guru 62920 points

Hi Gregory,

It is referenced to the top. (It should also be in units of C/W.)

Max

0 Gregory Duperon over 4 years ago in reply to Miguel Robertson

TI__Expert 6960 points

Max,

Do you have a junction to case (bottom) value or a junction to board value for either of the devices?

0 Miguel Robertson over 4 years ago in reply to Gregory Duperon

TI__Guru 62920 points

Hi Gregory,

The values aren't readily available to my knowledge, but given a little time I believe we should be able to run thermal models of these devices to generate the values. I'll put the request in to our thermal team and let you know the feedback. Typical cycle time is 1-2 weeks for the analysis.

Max

0 Gregory Duperon over 4 years ago in reply to Miguel Robertson

TI__Expert 6960 points

Hi Max,

Any update on the thermal models?

0 Miguel Robertson over 4 years ago in reply to Gregory Duperon

TI__Guru 62920 points

Gregory,

Re-simulations have completed for DS26F31. ThetaJC (top) is 59.4 C/W and ThetaJC (bottom) is 6.4 C/W. ThetaJB is 104.3 C/W. I sent a reminder to the team regarding the DS26F32 simulations, since I expected them to have completed by now.

Max

0 Miguel Robertson over 4 years ago in reply to Miguel Robertson

TI__Guru 62920 points

Gregory,

DS26F32 information is now available. ThetaJC (top) is 63.4 C/W and ThetaJC (bottom) is 7.8 C/W. ThetaJB is 108.9 C/W.

Regards,
Max

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DS26F31MQML-SP: Junction-to-case thermal resistance?