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SN65LBC175A: SN65LBC175AN

Allison Ma
Prodigy 230 points
Part Number: SN65LBC175A

Hi,

    Our customer has ordered sn65lbc175an twice. However, the products did not pass the solderability test and had slight oxidation. Please look at the solderability test report and help to explain the following questions:

1. Why did the part not pass the solderability test?

2. Does it affect the use?

Thank you for your help.

sn65lbc175an test report_.pdf

  • 0
    TI__Mastermind 25705 points

    I'm not familiar with the test method in the report. Here are some questions:

    1. Did the test engineer perform a bake (125C/24hrs) prior to testing to remove any excess moisture from their storage and environment?
    2. Why is 245C reflow temperature profile chosen for SAC305 (lead-free) solder paste? 
    3. Was any flux applied to the leads prior to solder dip?
    4. Where does the 95% criteria come from?
    5. Have the engineer run this test per the JEDEC JESD22A111 guidelines and solder dip criteria? 

    For your information, some information are posted on ti.com about solderability testing. See link below and screenshots. In this paper TI followed JESD22A111 for solderability testing. Note that TI qualification of this PDIP package performs solderability testing with Steam age, 8 hours; PB-Free solder. 

    Wave Solder Exposure of SMT Packages