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THVD2450: Package and availability

Part Number: THVD2450

Hi,

We plan to use the THDV2450 because of its robustness and the extended operational common mode range.
Now I have seen that there are three packages available but none of them have stock.

The only one that is available so far is the THVD2450DGK (VSSOP package, @ Mouser). The VSON package has the best thermical characteristics. VSSOP package is the most expensive.
Questions:

- When will this part be available at the TI store (all of the packages)?
- Do we have any limitations when using the VSSOP package (compared to VSON package)?
- Which package does TI recommend? Which one will be most widely used by others?

Thanks and best regards,

Patrick



  • Patrick,

    For SOIC, we are expecting inventory in sample store in mid/late May, TSSOP end of June/early July. VSON will be later and no confirmed date yet. I suggest you turn on the message notification from sample store to get the notification by email. Digikey and Mouser have TSSOP THVD2450DGKR units in stock now.

    There is no limitation using VSSOP vs. VSON.

    The most common package is still SOIC. VSSOP still has leads, while VSON is leadless. VSON is smallest one and the choice when customers really care about the footprint.